Exhibit 10.7
TECHNOLOGY LICENSE AGREEMENT FOR KOREA
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FIRST AMERICAN SCIENTIFIC CORP., a company
duly constituted under the laws of Nevada,
USA
having its head officeand principal place of
business
at # 26 – 7621 Vantage Way, Delta,
British
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(Hereinafter referred to as
“Licensor”)
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JP FAS KOREA LTD, a company duly
constituted under the laws of Korea having
its
registered address at 272-31 Nonhyun-Dong,
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(“Hereinafter referred to as
“Licensee”)
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THE GUARANTOR, an individual residing
at__________________________
____________________________
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(“Hereinafter referred to as
“Guarantor”)
WHEREAS Licensor is now and has been in the
business of bringing technological solutions to a wide variety of
environmental problems and more particularly, the areas of
materials reduction, waste reduction and global recycling;
WHEREAS Licensor has developed and is the
owner of material reduction and dewatering technology and know-how
named the “ KDS Micronex (tm)” referred to herein as
the “Licensor’s Technology” which is patented in
a number of countries as specified in Annex A (collectively
referred to herein as “the Patents”);
WHEREAS Licensee is desirous of profiting by
using Licensor’s Technology which is the subject matter of
the Patents and of securing an exclusive license from the Licensor
to use the Licensor’s Technology for the manufacture, sale
and use of the KDS Micronizing Machine in Korea to be used in any
industry.
WHEREAS Licensee has a permanent business in
Korea and has represented that they have the technical capability
and market knowledge to actively pursue the successful introduction
and marketing of the KDS Micronizing Machine into Korea ,
NOW THEREFORE, in consideration of the
premises and of the mutual covenants of the parties hereto to be
faithfully performed as hereinafter specified, the parties hereto
hereby covenant and agree as follows:
1.
PREAMBLE/RECITALS/DEFINITIONS
The preamble and recitals described at the
beginning of this agreement shall form an integral part of this
agreement as if recited at length herein;
The following terms shall have the following
meanings, unless the context implies otherwise:
“Applications” shall mean all
application of Licensor's Technology using a KDS Micronizing
Machine
“KDS Micronizing Machine” shall
mean that micronizing and dewatering machine created by Licensor as
it exists at the date of execution of this Agreement, utilising the
Licensor’s Technology, the specifications of which are
described in Annex B hereto and shall include any and all
improvements thereto from time to time,
“Licensor’s Technology”
shall mean all information and rights concerning the KDS
Micronizing Machine, the Patents, and the Know-How and shall
include any improvements thereto made from time to time,
“Know-How” shall mean all the
engineering, design, manufacturing, installation, commissioning and
operation knowledge, written or oral, whether in the form of
unpatented inventions, formulae, procedures and methods or current
and accumulate skills which the Licensor has acquired, and Licensor
will acquire, concerning the KDS Micronizing Machine and shall
include Technical Information.
“Technical Information” shall mean
all documents, drawings, diagrams, specifications, instructions,
and lists listed in Annex C hereto
“Patents” shall mean those patents
granted to or owned by Licensor, including all patent applications
which are subsequently approved after the date of this agreement,
the list of which appears in Annex A attached hereto, and includes
any new patents filed from time to time that pertain to
improvements to the KDS Micronizing Machine or the Licensor’s
Technology,
“Territory” shall mean the country
of Korea
“US$” shall mean the lawful
currency of the United States of America.
“Date of signing ”shall mean the
date of signing of this Agreement.
2.
GRANT OF LICENSE
Licensor hereby grants to the Licensee the
exclusive, non-transferable right to use the Licensor’s
Technology in the Territory for the Applications and more
particularly with regard to the Patents and Know-How for the
manufacture, sale, operation and use of KDS Micronizing Machines
for a period of twelve years from the date of signing this
Agreement subject to the terms and conditions set out herein.
As consideration for this grant of
license, the Licensee shall pay a Marketing License Fee
of $300,000 USD payable as follows:
a)
Carry over
credit for funds received from predecessor
licensee $43,500 USD
b)
Balance due of $ 256,500
USD payable by the issuance of 49 % of the outstanding shares of JP
FAS Korea Ltd. to the Licensor
c)
There will be a minimum
annual sales quota to maintain the license in good standing as
follows:
d)
There will be no minimum
sales quota once 20 machines have been sold and all royalty
payments due thereon have been paid.
e) Both
parties acknowledge that one KDS machine has been previously sold
to Daeyun Enterprises by theLicensor, but has not yet been
delivered, that this sale will continue to be under the control of
the Licensor,and that there will be no infringements on the
exclusivity provisions herein by so doing. However, once the
machine is delivered, the Licensee agrees to monitor and safeguard
the Licensor’s intellectual property rights visa
vis the Daeyun machine, and to provide service
to Daeyun, if required, on a fee for service basis as if
Daeyun were its own customer. Any future purchase(s) by Daeyun will
be handled by the Licensee.
3.
OBLIGATIONS OF LICENSOR
a) Licensor
agrees to supply Licensee with all technical information regarding
the use and operation of the KDS Micronizing Machine.
It is understood and agreed that the Technical
Information in respect of the KDS Micronizing Machine, which is
listed in Annex B, will be furnished by Licensor to Licensee within
30 days of the signing of this Agreement and that details of
improvements to the Licensor’s technology made from time to
time will be made available to the Licensee without additional
charge.
The Licensee’s engineers shall be given
adequate advice and schooling from the Licensor on how to use the
Technical Information for engineering, designing, manufacturing,
installation, and commissioning of the KDS Micronizing Machine.
This schooling of Licensee’s engineers, which will take place
in Canada and/or in Korea, shall be performed in accordance with
the Schooling Program specified in Annex E, at no cost for time.
The travel and accommodation expense for it in case of Korea shall
be paid by the Licensee.
The Licensor shall send a technician to Korea
for up to 5 working days to assist in the set-up and start-up
operation of the demonstration machine at no cost for time, but
travel and accommodation costs will be paid by the Licensee.
In furtherance of the program for development
of Licensor’s Technology by Licensee, Licensor grants to
Licensee permission at any time to send, at Licensee’s
expense, a reasonable number of technicians for a reasonable time,
to Licensor’s plant to obtain any instructions or information
which Licensee may reasonably require to enable Licensee to use the
Licensor’s Technology
Licensor shall, at the request by Licensee,
furnish literature, mats of artwork and advertising films, slides,
and other promotional and training materials available to Licensee
at cost.
Licensor shall permit throughout the life of
this agreement the exclusive use by Licensee of the trademark
“KDS Micronex” owned by Licensor.
Both parties will freely exchange all current
and updated KDS technical data and information between themselves
without cost
For any commercial project, on a case-by-case
basis, the additional assistance will be provided on agreed daily
rate plus expenses.
In the event Licensor receives any inquiry
from any third party in respect of the KDS Micronizing Machine from
within the Territory, Licensor shall refer such to Licensee.
4.
OBLIGATIONS OF LICENSEE
Licensee agrees to use every reasonable
commercial effort to fully exploit Licensor’s Technology to
the greatest extent possible throughout the Territory, including
providing its marketing, technical and business expertise to adapt
the technology to local conditions and local customers needs, and
to seek out new uses and applications that will enhance the value
of the Technology and the business opportunity for both
parties.
Licensee agrees that it will not do or permit
any act or thing whereby any of the rights granted herein or the
proprietary rights to use any trademark, trade name, or design of
the Licensor may be endangered and that it will not claim any
proprietary int